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5G terminal application shaping PCB global applications and market trends

  • Categories:News Center
  • Time of issue:2021-01-29 11:33
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(Summary description)As the global 4G application matures and the number of global terminal demand continues to decline, the topic of wireless transmission efficiency and the value-added of new applications in the new generation of 5G applications is heating up, which has become a new opportunity for the market to sprint to the peak again, even when the demand for replacement is not obvious. , The global market still has significant support for 5G terminal product peripheral demand and even PCB applications...

5G terminal application shaping PCB global applications and market trends

(Summary description)As the global 4G application matures and the number of global terminal demand continues to decline, the topic of wireless transmission efficiency and the value-added of new applications in the new generation of 5G applications is heating up, which has become a new opportunity for the market to sprint to the peak again, even when the demand for replacement is not obvious. , The global market still has significant support for 5G terminal product peripheral demand and even PCB applications...

  • Categories:News Center
  • Author:Chen Wanjie
  • Origin:
  • Time of issue:2021-01-29 11:33
  • Views:
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DIGITIMES project

As the global 4G application matures and the number of global terminal demand continues to decline, the topic of wireless transmission efficiency and the value-added of new applications in the new generation of 5G applications is heating up, which has become a new opportunity for the market to sprint to the peak again, even when the demand for replacement is not obvious. , The global market still has significant support for 5G terminal product peripheral demand and even PCB applications...


Under the trend of 5G applications, in order to meet the design conditions of 5G efficient wireless connection and maximize the terminal conditions for users to wirelessly access network resources, it has become an inevitable major issue that the equipment needs to introduce multiple antennas and anti-interference design conditions. In particular, there is a large amount of audiovisual multimedia data transmission requirements under 5G mobile applications. The data transmission volume on the 5G transmission link is several times the gap with 4G applications. In the past, browsing the audiovisual channel may only need to maintain the quality of the 1080p or 2K video link. However, in a 5G application environment, it is necessary to provide simultaneous multi-view and multi-media composite digital media presentation. The amount of data that may be generated by the same type of wireless entertainment application is several times different.

5G wireless application scenarios fascinating terminal multiple applications have a fever

In addition to user usage scenarios, 5G can increase benefits based on the high efficiency of transmission lines and expand a richer and diversified composite digital media and entertainment new-type applications. Similarly, new wireless access technologies in areas with high user density are also necessary Achieve a seamless user experience, with investment in value-added application scenarios such as a new generation of smart surveillance, smart home, smart city, and smart driving.

As for the key role of PCB, in fact, under 5G-related value-added applications, what is tested is not only the wireless link line quality and transmission efficiency of equipment processing high-frequency and huge amounts of information, but also how the terminal can be used in terminals that are several times that of 4G application scenarios. Under the conditions of noise processing, a new generation of technology is used to meet the wireless access needs of 5G application scenarios.

If you look at the 3GPP specifications, you can find that 5G applications include sub-6GHz, millimeter wave (mmWave) application frequency bands, and in each application area, it is planned to subdivide the frequency bands to be used for different operators, countries and regions, and different telecommunications operations. Compared with the 4G era, the allocation of available frequency bands for vendors to obtain licenses will be more complicated. Complicated frequency band division and processing not only require consideration of equipment PCB anti-interference and signal anti-interference issues for 5G-related applications. In fact, 5G terminal design must also bear retrospective compatibility. For example, 5G terminal equipment must still consider retrospective support for 4G TD-LTE /FD-LTE, TDSCDMA/CDMA2000/WCDMA, GSM...and other old communication system compatibility conditions, the design complexity will be more complicated than previous generations of solutions.

Although global smart terminals are affected by the epidemic, the surrounding 5G application topics are still hot

Affected by the decline in global demand for smart application terminals, and under the 5G issue, even if the market still holds a stable view of the estimated number of terminals in 2020, the output value of PCBs for smart handheld devices that rely on high-end processes is still optimistic, because the new generation of In response to 5G product applications, high-end PCB circuit boards must be smaller in size while maintaining the high-density layout of the carrier board, high heat dissipation effect, and noise and anti-interference requirements for multi-antenna construction, which also greatly increases the profit per unit of PCB output. , Becoming a key product field for global Taiwan, China, South Korea, Japan and other large circuit board manufacturers.

Even if the global COVID-19 pandemic affects market numbers in the first half of 2020, as 5G application-related issues increase, such as the acceleration of 5G base station and terminal service deployment by telecom service providers, 5G high-traffic, and low-latency value-added Applications have been launched on the market one after another, with the launch of new foldable screens or mobile phones with novel configurations and designs of terminal smartphones to attack the 5G market, which continues to stimulate the topic of terminal market. Even if the global shipments of mobile phones are shrinking, the actual focus is Major manufacturers are still actively fighting for the market under the 5G competitive environment.

Major Japanese factories have advantages in the layout of special materials, 5G development forces cannot be underestimated

Observing the current product layout of the advanced PCB market in Japan, in terms of key flexible circuit board products for smart phones, large Japanese manufacturers have begun to expand the application fields outside smart handheld devices, such as robotics, biomedical, smart cars, etc. New applications require market expansion, and current expansion trends still need to be continuously followed up.

If you examine the trends of Japanese manufacturers in terms of 5G application trends, in addition to the application field requirements of smart handheld devices, the layout of niche applications derived from the topic of 5G cannot be underestimated, such as the demand for flexible circuit boards related to telemedicine smart sensing, Advanced intelligent applications such as robots. In the PCB application layout of the 5G market, Japan has a meticulous layout for high-frequency application PCBs. Key manufacturers such as Panasonic and Hitachi Chemical Company (Hitachi Chemical Company) and other key manufacturers have corresponding PCB substrates and soft/hard PCBs. Material layout. It can be a relatively complete key manufacturer of 5G terminal intelligent application related solutions.

Although the key Korean manufacturers withdraw from the low-profit product market, the dynamics of major Korean mobile phone manufacturers still need to be observed

In contrast to South Korea’s PCB industry, the performance of South Korean manufacturers in the PCB field has not been conspicuous in recent years. However, thanks to the blessing of the brand sales of local smart mobile terminals in South Korea, its market share in the global PCB market cannot be underestimated. Review South Korea’s major PCB manufacturers LG Innotek announced that it will close its PCB business at the end of 2019 because of the high cost of HDI (High Density Interconnector) high-density interconnect circuit boards, and profits are gradually declining under the highly competitive market. Therefore, it was decided to officially withdraw from the market in mid-2020.

Another key South Korean manufacturer Samsung Electro-Mechanics Co. has also withdrawn from the production of HDI products in China due to similar decisions. The focus of the market must be focused on when the two major Korean PCB manufacturers withdraw from smart handheld devices. After the HDI application market of materials is supplied, the corresponding market vacancy will be filled by other Korean factories? It is still the new changes in its original market, which must be focused on later.

Narrow semiconductor, terminal foundry production advantages, Taiwan factories have outstanding output value

Examining the current status of Taiwan’s PCB market, due to manufacturing demand for electronic equipment and foundry production, Taiwan’s market share in 2019 ranked first in the world. During 2020, it will also benefit from the stimulation of 5G global demand issues, basically Taiwan That is to say, it has excellent advantages, not only semiconductors, key components and other manufacturing technology and capacity advantages, but also in the OEM manufacturing of terminal equipment due to the booming demand for 5G, which drives the corresponding high-end carrier board, soft/hard board and other application needs.

Especially in high-profit projects such as ABF (Ajinomoto Build-up Film) substrates, IC application carrier boards, high-frequency multilayer boards and other advanced and high-profit raw materials that will be used in 5G infrastructure construction, Taiwanese factories are both in R&D, production and application. Key manufacturers have formed an industrial chain structure. Not only are the 5G applications optimistic about the market outlook and continue to stimulate the fermentation of related applications, while other global competitors are rushing to compete for food market share, Taiwan has key IC production capabilities, key raw material research and development, and production. With the advantage of mass production of terminal equipment, the demand for corresponding high-end PCB applications will continue to rise in the later period.

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